Semiconductor Packaging & Testing
Material Automation for Semiconductor Packaging
Automated material transfer system combined with purification to reduce operator entry frequency in a packaging clean zone.
Reference projectISO 6 / 7
Challenge
High operator traffic was identified as a major contamination and yield risk. The client wanted to keep the clean zone tighter without major layout changes.
Solution
Custom material air shower integrated with roller and lift transfer, designed to interface with existing production equipment and reduce the need for personnel to enter the core zone.
Results
•Significant reduction in personnel entry frequency
•Improved process stability feedback from customer
•System designed for future MES connection
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